The previous First 2018 International Conference on Electron Device and Mechanical Engineering（ICEDME 2018）was successfully held in Wuhan,China during March 23-25, 2018.
The 2019 2nd International Conference on Electron Device and Mechanical Engineering (ICEDME 2019）was successfully held in Suzhou, China during March 29-31, 2019.
The 2020 3rd International Conference on Electron Device and Mechanical Engineering (ICEDME 2020) was successfully during March 20, 2020, online.
Welcome to the official website of the 2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME 2021), which will be held in Guangzhou, China during March 19-21, 2021. ICEDME 2021 is organized by AEIC Academy Exchange Information Center and Association Franco-Chinoise en Sciences & Technologies (AFCST). It is a yearly International conference which the experts of this kind of field from different areas and countries will be invited to give the relevant speech. ICEDME 2021 is to provide a platform for researchers, professionals and other experts from around the world to present their research results in Electron Device and Mechanical Engineering.
2021 4th International Conference on Electron Device and Mechanical Engineering (ICEDME 2021) is a leading conference for all researchers from different countries and territories to present their research results about Electron Device and Mechanical Engineering.
As an influential international conference, ICEDME 2021 provides the experts with a valued opportunity to communicate with each other coving its large team, dependable committee and a large of sponsors from all over the world. A lot of participants from many kinds of fields will join in this grand international conference.
University of Bourgogne Franche-Comté (UTBM)
Prof. Dr. Zahriladha Zakaria
Universitiy Teknikal Malaysia Melaka, Malaysia
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICEDME2021 will be submitted by IEEE CS CPS (Conference Publishing Services) for indexing by IEEE Xplore, EI Compendex, Scopus.
ICEDME2018 EI: click
ICEDME2019 EI: click
ICEDME2020 EI: click
2. SCI journal
Excellent papers will be recommended directly to the following or other suitable SCI journals
Journal 1：Journal of Materials Science: Materials in Electronics（ISSN: 0957-4522, IF=2.195, regular issue）
Journal 2：Thermal Science（ISSN: 0354-9836, IF=1.541, special issue）
Submission should be in WORD（.doc）format only, and specified templates will be given after evaluation.
Online submission 【SCI online submission】
For more information about SCI papers and journals, please feel free to contact Editor Li: 18127812811/ Editor Lin: 13922157504. (WeChat/Mobile phone)
A. Full Paper (for Presentation and Publication)
Accepted full paper will be invited to give the oral presentation at the conference and be publsihed in the conference proceedings.
B. Abstract (Presentation only)
Accepted abstract will be invited to give the oral presentation at the conference, the presentation will not be published.
C. EI Template (Download)
*All submissions must not be less than 4 pages in length.
(authors will be charged extra 50 USD/page if the manuscript length is more than 4 pages)
Please send the full paper & abstract to SUBMISSION SYSTEM.(word and pdf)